Type of Funding: Federal and State Funding, BMBF


The use of ultra-thin, two-dimensional materials in electronics and sensor technology enables completely new types of transparent, flexible and biocompatible solutions with minimal resource consumption. However, the technology for this promising area of microelectronics has not yet reached the level of maturity required for industrial applications. The Bochum Microelectronics Research Laboratory for 2D electronics aims to change this. The scientists led by Prof. Dr.-Ing. Martin Hoffmann at Ruhr-Universität Bochum are working to establish a stable process that integrates additive and subtractive technologies with a high yield at wafer level, allowing transfer to industry.

In doing so, they have the complete process chain in mind - from the raw materials, the so-called precursors, to the high-precision generation of ultra-thin layers by atomic layer deposition and structuring with novel selective and low-damage plasma etching processes for the defined exposure of individual ultra-thin layers.

In the project, an innovative, monolayer-accurate deposition and etching technology at low temperatures for the fabrication of low-cost, flexible microelectronics and ultrasensitive microsensors is being developed and implemented in a 200 mm cluster system on substrates compatible with the Forschungsfabrik Mikroelektronik Deutschland and industrial users.

The aim is to develop novel, particularly resource-efficient electronic systems based on 2D integration. These include flexible microelectronics, highly sensitive sensors as well as microfluidic systems for medical technology and energy conversion and autonomous sensor arrays.

Project Website

Contact Person at UA Ruhr:
Prof. Dr.-Ing. Martin Hoffmann, Ruhr-Universität Bochum

UA Ruhr Researchers:
Prof. Dr.-Ing. Peter Awakowicz, Ruhr-Universität Bochum
Dr.-Ing. Claudia Bock, Ruhr-Universität Bochum
Prof. Dr. Anjana Devi, Ruhr-Universität Bochum
Prof. Dr.-Ing. Martin Hoffmann, Ruhr-Universität Bochum

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